Are you curious about which BGA PCB manufacturers stand out in today’s competitive market? Understanding the top factories is crucial for ensuring quality and reliability in your projects. Discovering the best options can save you time and money. Dive in to find out which manufacturers deserve your attention!
BGA – Ball Grid Array PCB Manufacturing and Assembly – JHYPCB
Product Details: BGA PCB is a special PCB used to accommodate BGA components, offering compact, reliable, and space-saving designs.
Technical Parameters:
– Types: PBGA, CBGA, TBGA, EBGA, FCBGA, MicroBGA
– Common pitches: 0.40mm, 0.50mm, 0.80mm, 1.00mm, 1.27mm
Application Scenarios:
– Military applications
– Consumer Electronics
– Automotive Sector
– Flat Electronics Systems
– Integrated Circuits in TVs, computers, smartphones
Pros:
– More leads and better space utilization compared to QFPs.
– Improved electrical performance with low thermal resistance.
Cons:
– Solder balls are not mechanically compliant, leading to potential fractures.
– Difficult inspection of faults due to hidden connections.
BGA PCB – Ball Grid Array PCB Board Manufacturer | ViasionPCB
Product Details: BGA PCB (Ball Grid Array PCB) is a printed circuit board that connects the substrate with an embedded chip to the PCB through solder balls.
Technical Parameters:
– Multi-layer PCB with vias or plated through holes for signal routing
– High Tg (glass transition) substrate materials
Application Scenarios:
– High-density electronic devices
– High-reliability applications
Pros:
– Smaller package footprint compared to other semiconductor packages
– Good electrical and thermal performance
Cons:
– Difficult to inspect and repair
– Challenges in PCB fabrication and assembly
TOP 10 global BGA packaging substrate suppliers in 2024
Product Details: BGA packaging substrates used in PCB assembly for integrated circuits with solder balls for electrical connections.
Technical Parameters:
– High-density interconnection (HDI) capabilities
– Various substrate types including EPS, EDS, and ETS
Application Scenarios:
– Automotive electronics
– Medical devices
Pros:
– Compact design suitable for limited space
– Reliable electrical connections
Cons:
– Requires precise soldering techniques
– Potential for thermal issues in high-density applications
Bga pcb assembly – PCB manufacturing and PCB assembly manufacturer …
Product Details: BGA PCB Assembly
Technical Parameters:
– High-density interconnections
– Thermal performance
Application Scenarios:
– Consumer electronics
– Telecommunications
Pros:
– Compact design
– Improved performance
Cons:
– Higher manufacturing cost
– Complex assembly process
Ball Grid Array, BGA Assembly Services | SMT Manufacturer – MADPCB
Step-by-step BGA manufacturing process – RayMing PCB
Product Details: Ball Grid Array (BGA) is an electrical packaging technology used for mounting integrated circuits and electronic components on a substrate with solder balls for connections to PCBs.
Technical Parameters:
– Substrate material: FR4, epoxy resin reinforced with fiberglass
– Solder ball diameter: Ranges from 0.2mm to 1.0mm
Application Scenarios:
– Laptops and mobile phones
– Game consoles and automotive electronics
Pros:
– Increased density and better electrical performance
– Compact size ideal for portable electronic devices
Cons:
– Requires specialized equipment and trained technicians
– Potential for poor electrical connections if solder ball attachment is insuffici…
BGA PCB Assembly – MOKO Technology
Product Details: BGA PCB Assembly Service by MOKO Technology
Technical Parameters:
– Minimum pitch size: 0.4mm
– Placement accuracy: +/- 0.03 mm
Application Scenarios:
– High-density electronic component packaging
– Integrated circuit assembly
Pros:
– Efficient use of space
– Better thermal performance
– Higher electrical conductivity
– Easy to assemble and manage
– Less damage to leads
Cons:
– Requires special equipment for rework
– Potential issues with misalignment and solder joint bridging
BGA PCB: Ball Grid Array Printed Circuit Boards – Fx PCB
Product Details: Ball Grid Array (BGA) Printed Circuit Boards are compact, high-performance PCBs used in various electronic devices, known for their efficient heat dissipation and high pin counts.
Technical Parameters:
– High-density interconnect
– Enhanced electrical performance
Application Scenarios:
– Consumer electronics like laptops and mobile phones
– High-performance computing applications
Pros:
– Space efficiency and compact design
– Improved heat dissipation and mechanical durability
Cons:
– Soldering complexity and inspection challenges
– Repair difficulty and higher manufacturing costs
BGA & PCB Manufacturing & Assembly Services – Candor Ind.
Product Details: BGA (Ball Grid Array) is a type of packaging for integrated circuits that uses solder balls to connect the chip to the PCB, allowing for high-density connections.
Technical Parameters:
– High interconnection density
– Lower thermal resistance
Application Scenarios:
– Used in complex electronic devices
– Suitable for high-performance computing applications
Pros:
– Requires fewer pins compared to PGA, saving space
– Better heat dissipation and lower manufacturing costs
Cons:
– Requires precise alignment during installation
– Potential for solder bridging if not handled properly
BGA Assembly: A Comprehensive Guide for Manufacturers- Jarnistech
Product Details: BGA (Ball Grid Array) technology for PCB assembly, allowing for high pin density and improved thermal performance.
Technical Parameters:
– Minimum BGA Pitch: 0.25 mm
– BGA Ball Count: 2 – 50
Application Scenarios:
– Smartphones
– Automotive systems
Pros:
– Higher pin density
– Improved thermal performance
Cons:
– Complex assembly process
– Requires precise alignment and inspection
Related Video
Comparison Table
| Company | Product Details | Pros | Cons | Website |
|---|---|---|---|---|
| BGA – Ball Grid Array PCB Manufacturing and Assembly – JHYPCB | BGA PCB is a special PCB used to accommodate BGA components, offering compact, reliable, and space-saving designs. | – More leads and better space utilization compared to QFPs. – Improved electrical performance with low thermal resistance. | – Solder balls are not mechanically compliant, leading to potential fractures. – Difficult inspection of faults due to hidden connections. | www.pcbelec.com |
| BGA PCB – Ball Grid Array PCB Board Manufacturer | ViasionPCB | BGA PCB (Ball Grid Array PCB) is a printed circuit board that connects the substrate with an embedded chip to the PCB through solder balls. | – Smaller package footprint compared to other semiconductor packages – Good electrical and thermal performance | – Difficult to inspect and repair – Challenges in PCB fabrication and assembly |
| TOP 10 global BGA packaging substrate suppliers in 2024 | BGA packaging substrates used in PCB assembly for integrated circuits with solder balls for electrical connections. | – Compact design suitable for limited space – Reliable electrical connections | – Requires precise soldering techniques – Potential for thermal issues in high-density applications | www.pcbaaa.com |
| Bga pcb assembly – PCB manufacturing and PCB assembly manufacturer … | BGA PCB Assembly | – Compact design – Improved performance | – Higher manufacturing cost – Complex assembly process | www.andwinpcb.com |
| Ball Grid Array, BGA Assembly Services | SMT Manufacturer – MADPCB | |||
| Step-by-step BGA manufacturing process – RayMing PCB | Ball Grid Array (BGA) is an electrical packaging technology used for mounting integrated circuits and electronic components on a substrate with solder… | – Increased density and better electrical performance – Compact size ideal for portable electronic devices | – Requires specialized equipment and trained technicians – Potential for poor electrical connections if solder ball attachment is insuffici… | www.raypcb.com |
| BGA PCB Assembly – MOKO Technology | BGA PCB Assembly Service by MOKO Technology | – Efficient use of space – Better thermal performance – Higher electrical conductivity – Easy to assemble and manage – Less damage to leads | – Requires special equipment for rework – Potential issues with misalignment and solder joint bridging | www.mokotechnology.com |
| BGA PCB: Ball Grid Array Printed Circuit Boards – Fx PCB | Ball Grid Array (BGA) Printed Circuit Boards are compact, high-performance PCBs used in various electronic devices, known for their efficient heat dis… | – Space efficiency and compact design – Improved heat dissipation and mechanical durability | – Soldering complexity and inspection challenges – Repair difficulty and higher manufacturing costs | sfxpcb.com |
| BGA & PCB Manufacturing & Assembly Services – Candor Ind. | BGA (Ball Grid Array) is a type of packaging for integrated circuits that uses solder balls to connect the chip to the PCB, allowing for high-density… | – Requires fewer pins compared to PGA, saving space – Better heat dissipation and lower manufacturing costs | – Requires precise alignment during installation – Potential for solder bridging if not handled properly | www.candorind.com |
| BGA Assembly: A Comprehensive Guide for Manufacturers- Jarnistech | BGA (Ball Grid Array) technology for PCB assembly, allowing for high pin density and improved thermal performance. | – Higher pin density – Improved thermal performance | – Complex assembly process – Requires precise alignment and inspection | jarnistech.com |
Frequently Asked Questions (FAQs)
What is a BGA PCB?
A BGA PCB, or Ball Grid Array Printed Circuit Board, is a type of circuit board that uses a grid of solder balls to connect the chip to the board. This design allows for better electrical performance and heat dissipation compared to traditional packaging methods.
What should I consider when choosing a BGA PCB manufacturer?
When selecting a BGA PCB manufacturer, consider their experience, production capabilities, quality control processes, and customer reviews. It’s also important to check their certifications and whether they can meet your specific design and volume requirements.
How long does it take to manufacture BGA PCBs?
The manufacturing time for BGA PCBs can vary based on complexity and order volume. Typically, it can take anywhere from a few days to several weeks. Always ask your manufacturer for a timeline to ensure it aligns with your project schedule.
What are the common applications of BGA PCBs?
BGA PCBs are widely used in various applications, including consumer electronics, telecommunications, automotive systems, and medical devices. Their compact design and efficient thermal management make them ideal for high-performance devices.
How can I ensure the quality of my BGA PCBs?
To ensure quality, work with a reputable manufacturer that follows strict quality control standards. Request samples, review their testing processes, and consider third-party inspections. Clear communication about your specifications and expectations is also crucial.